1～3 item / All 3 items
Generally, high multi-layer lamination technology is adopted in manufacturing.
Number of layers: 4 layers Material: FR4 Board thickness: 2.28 +/- 0.23 mm Surface treatment: Electroless gold plating Copper foil thickness: 1/3/0.85 OZ
Generally, high multilayer lamination technology is adopted in manufacturing.
Number of Layers: Six Layers Material: FR-4 (High TG 170) Board Thickness: 1.6 +/- 0.1mm Surface Treatment: Electroless Nickel/Electroless Gold Copper Foil Thickness: H/1/1/1/1H OZ Remark: Blind Holes: L1/L2 & Blind Holes
Generally, high multilayer stacking technology is adopted in manufacturing.
Number of layers: 12 layers Material: FR4 TG175 Board thickness: 2.0 +/- 10% mm Surface treatment: Electroless nickel/electroless gold plating Copper foil thickness: H/1/1/1/1H OZ Remark: Blind holes: L1/L2 & blind holes
